Disclaimer: Please view the videos in HD mode (high pixel resolution) for more clearance. In this world of fast growing electronics technology & miniaturization process, thousands of new portable and light weight electronics products are launched in the market each day and in various fields of electronics such as - consumer electronics, medical electronics, communication electronics, defence electronics, industrial electronics and in aerospace electronics. Due to complex circuit design & miniaturization, excessive amount of heat dissipation is happening in electronics products which is reducing the life-span of the components/devices. Thus thermal management of all electronics products has become an important issue. In this role of thermal management, “electronics packaging” plays a very important part. Here in this short course you will study in detail about the “advanced materials used in electronics packaging” & “thermal management materials’ that has been developed over the recent years. What you will learn in this course What is electronics packagingWhy we need electronics packaging6 Hierarchy in electronics packaging3 Packaging variations7 different types of packaging configurations & their applicationsDifferent types of substrate materialsWhat is so great about FR4 boardDifference between FR1/2/3 & FR4 board propertiesMaterials used to form electronic glass substrate and application of electronic glassIn-depth knowledge on ceramic substrate materialsGELVET TIM technologyMetal matrix composite (MMCS) materials: Al-Si, Al-SiC, Cu-Diamond, Al-Diamond, Gold-Gold Interconnections (GGI) & Al-Graphite compositeTechnical details on Carbon Nano Tube (CNTS)PCM materialsElectro-magnetic-interference (EMI) shielding materialsAt the end of this course, a RESOURCE File is provided which will help you a lot in further understanding of the topics given in this course.
